APAC

Zuken Innovation World Japan 2026

Zuken's 50th-anniversary Japanese user conference

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About this event

Zuken Innovation World returns to Yokohama for its 50th-anniversary edition, covering CR-8000 PCB/system design and E3.series with customer case studies and industry-trend sessions.

Speakers

50th anniversary special keynote

Opening / Zuken strategy keynote

Hiroyuki Fujiwara

Zuken product roadmap

Zuken product roadmap

Manager, Marketing Dept.

OKI Circuit Technology

Next-Generation Electronics in the AI Era: Required Characteristics and Technology Trends for PCBs

Field Technical Support & Marketing Director

An Introduction to TSMC OIP Ecosystem Powering the Evolution of AI

Hideyuki Masuyama

Director, Electrical Development

Issues Identified Post-Deployment of Circuit DR Navi and Improvement Initiatives

Expert, Electrical Development 5

Issues Identified Post-Deployment of Circuit DR Navi and Improvement Initiatives

Manager, Technology Innovation Office

Tokyo Electron Miyagi

Next Step in Digital Transformation for the Electrical Industry

Technology Innovation Office

Tokyo Electron Miyagi

Next Step in Digital Transformation for the Electrical Industry

Executive Officer, GM, Technology Planning Dept., Robot Solutions Business Div.

Integrating E3.series and 3DEXPERIENCE via DS-E3

Motonori Kimura

Technology Management Section, Robot Solutions Business Div.

Integrating E3.series and 3DEXPERIENCE via DS-E3

General Manager, DX Division

How to Drive Transformation in Large Enterprises in the AI Era

Christopher Höfele

VP Hardware & Lifecycle Engineering Applications, Engineering Digitalization & IT

Schaeffler's Digital Transformation in Engineering

Toyohiro Chikyo

Hub Head & Special Advisor to the President

Applications of Materials Informatics in the Semiconductor Field and Its Expansion to 3D Integrated Circuits

Director, Electrical Engineering Department

LOVOL Heavy Industry Group

Driving Electrical Design Transformation at LOVOL Heavy Industry with E3.series

Senior Staff, Design Room 2 Group 4, HMI Electronics Technology Dept.

Practicing and Establishing System Design Based on Requirements Analysis

Design Room 2 Group 4, HMI Electronics Technology Dept.

Practicing and Establishing System Design Based on Requirements Analysis

Takashi Nagaoka

Senior Staff, System Planning Dept.

Migration from Board Designer to Design Force and Future Prospects

Director, Senior Managing Executive Officer & CTO

Furuno Electric

Toward Organizational Assetization Through MBSE - Preserving Design Intent and Standards Knowledge with GENESYS

Section Manager, Development Infrastructure Management Section

Furuno Electric

Toward Organizational Assetization Through MBSE

Executive Officer, GM of DX Strategy Division

Connecting Technologies, Leveraging Strengths! Building an ECM System for Design DX

Executive Officer, GM of Technology HQ

The Truth About PCB Design Know-How, Part 2: 6GHz Differential-Signal Radiated Noise Verification

Director, Global Research Center for Quantum-AI Hybrid Technology Business Development

The Computing Revolution in the AI and Quantum Age, and Japan's Role

TPG, Principal Engineer

3DIC Compiler in the Chiplet Era

Michiyoshi Ishii

Staff Engineer, Safety, Autonomy & Embedded Software Application Engineering

Connecting Electrical Design Reliability and Safety via Safety Requirements

Shuji Takahashi

Senior Partner, Partner Section, PI Development Dept.

Connecting Electrical Design Reliability and Safety via Safety Requirements

Senior Application Engineer

Next-Gen Design/Analysis Workflow from Zuken x Ansys

Staff Engineer, Technical Support Engineering

EMC/ESD Analysis for EV, Aerospace and Electronics Development

Solution Expert, EDA Solutions Engineering Dept.

Keysight Technologies

Interconnect Analysis Technology Supporting Chiplet Design

Senior Specialist, SIMULIA Technical Leader

Dassault Systèmes

Productivity Gains from CR-8000 x 3DEXPERIENCE Platform Integration

Product Technology Dept. Section 1, Digital Engineering Business Div.

SCSK Corporation

Assessing Cable Routing Feasibility with 3D Simulation

President & CEO

Lattice Technology

Accelerating Manufacturing DX with 3D x AI - the XVL Pipeline

Elemental Technology Development Dept., EM Design Team

Ultimate Technologies

Package Design and Optimization Using High-Speed Switching Devices

RITA Electronics

Methodology for Designing and Developing PCBs with LPDDR5/DDR5/DDR3 High-Speed DRAM

President & Representative Director

Next-Gen Manufacturing Realized by BOM x AI

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