North America
IMAPS Symposium 2026
IMAPS' flagship advanced packaging and heterogeneous integration symposium
About this event
The 59th IMAPS Symposium covers advanced packaging, heterogeneous integration, 3D-IC and co-packaged optics, with 18 professional development courses, five technical tracks and keynotes from Qualcomm, Cerebras, IBM and Marvell.
Social media & coverage
“Pre-event technical-program overview naming the Qualcomm, Marvell and Cerebras keynote speakers.”
3D InCites EditorOpen on 3dincites.com
“Exhibit-hall and exhibitor spotlight preview ahead of the symposium.”
3D InCites EditorOpen on 3dincites.com
“Announces a new laser-release material presentation and Dan Sullivan joining the AI-era supply-chain panel.”
Brewer ScienceOpen on brewerscience.com
“General Chair shares the Final Program & Exhibit Directory.”
Karthik DhandapaniOpen on linkedin.com
“Post reflecting on the IMAPS Boston Symposium experience.”
Brian SchiemanOpen on linkedin.com
“Announces Tyndall National Institute's participation in IMAPS 2026.”
Tyndall National InstituteOpen on linkedin.com
“Promotes Neil He's solderability paper presentation at IMAPS 2026.”
Rochester ElectronicsOpen on facebook.com
Speakers
DP
Dr. PR "Chidi" Chidambaram
Qualcomm
CustomerKeynote 1: System Engineering Solutions to Meet Challenging AI Chipset Requirements
JF
Jean-Philippe Fricker
Cerebras Systems
CustomerKeynote 2: Packaging the Wafer: Materials and Integration for Wafer-Scale Computing
AK
Arvind Kumar
IBM
CustomerKeynote 3: Heterogeneous Integration Beyond the Reticle: Packaging the Future of AI Infrastructure
SP
Suresh Pothukuchi
Marvell
CustomerKeynote 4: Breaking the Interconnect Barrier: Photonics Packaging for the Next Era of Compute, Memory, and AI Systems
RN
Rabindra N. Das
MIT Lincoln Laboratory
AcademiaPanel moderator: Quantum Computing - Present Status and Opportunities in Heterogeneous Integration
WO
William Oliver
MIT
AcademiaPanel: Quantum Computing - Present Status and Opportunities in Heterogeneous Integration
MK
Muir Kumph
IBM
CustomerPanel: Quantum Computing - Present Status and Opportunities in Heterogeneous Integration
BM
Brian Maertz
Google Quantum AI
CustomerPanel: Quantum Computing - Present Status and Opportunities in Heterogeneous Integration
KT
Kang Tan
QuEra Computing
CustomerPanel: Quantum Computing - Present Status and Opportunities in Heterogeneous Integration
ME
Mollie E. Schwartz
MIT Lincoln Laboratory
AcademiaPanel: Quantum Computing - Present Status and Opportunities in Heterogeneous Integration
JV
Jan Vardaman
TechSearch International
ConsultantPanel moderator: Supply Chain Shortages Driven by Growth in the AI Era
LJ
Lorne Johnson
Toppan
VendorPanel: Supply Chain Shortages Driven by Growth in the AI Era
SR
Simarpreet Rattan
Microsoft
CustomerPanel: Supply Chain Shortages Driven by Growth in the AI Era
FK
Farhad Kiaei
HD Microsystems
VendorPanel: Supply Chain Shortages Driven by Growth in the AI Era
BW
Brett Wilkerson
AMD
CustomerPanel: Supply Chain Shortages Driven by Growth in the AI Era
DS
Dan Sullivan
Brewer Science
VendorPanel: Supply Chain Shortages Driven by Growth in the AI Era
JL
John Lau
Unimicron
VendorPDC: Hybrid Bonding and Glass Packaging for Chiplet Heterogeneous Integration; PDC: Heterogeneous Integration of ASIC Switch, Photonic IC and Electronic IC - Co-Packaged Optics
TT
Tolga Tekin
Fraunhofer IZM
AcademiaPDC: From Co-Packaged Optics to Optical I/O and Photonic Chiplets
RZ
Rongwei Zhang
Texas Instruments
CustomerPDC: High-Performance Die Attach Materials for Advanced Packaging
SS
Shubhada Sahasrabudhe
QuRIuS
ConsultantPDC: Introduction to Quality & Reliability of Advanced Microelectronics Packaging; Enabling Reliable Heterogeneous Integration: Deep Dive into Qualification Methodology
ST
Shalabh Tandon
QuRIuS
ConsultantPDC: Introduction to Quality & Reliability of Advanced Microelectronics Packaging; Enabling Reliable Heterogeneous Integration: Deep Dive into Qualification Methodology
IN
Ivan Ndip
Fraunhofer IZM
AcademiaPDC: Fundamentals of Substrates and Interposers; Applications of Substrates and Interposers
VS
Venky Sundaram
3D System Scaling
VendorPDC: Fundamentals of Substrates and Interposers; Applications of Substrates and Interposers
HH
Habib Hichri
Ajinomoto
VendorPDC: Fundamentals of Substrates and Interposers; Applications of Substrates and Interposers
TD
Tom Dory
ITM Consulting
ConsultantPDC: 3D Package Technology and Assembly Processes
BK
Beth Keser
SEMI
ConsultantPDC: Advances in 2.3D Fan-Out Wafer Level Packaging (FOWLP)
RM
Rajen Murugan
Texas Instruments
CustomerPDC: System-Level Predictive EMI/EMC Modeling, Simulation, and Characterization
VG
Vikas Gupta
ASE
VendorPDC: Evolution of Flip Chip Package Technology as CoWoS Enabler
JG
Jeff Gotro
InnoCentrix
ConsultantPDC: Polymers for Advanced Packaging
AL
Amy Lujan
SavanSys
VendorPDC: Cost Breakdown of Advanced Packaging Technologies for Chiplets
CB
Christo Bojkov
UT Dallas
AcademiaPDC: Thermal Interface Materials (TIM): Integration, Metrology and Reliability
JM
Joana Mendes
Instituto de Telecomunicações
AcademiaPDC: Thermal Interface Materials (TIM): Integration, Metrology and Reliability
SS
Stephen Stagon
Boston Materials
VendorPDC: Thermal Interface Materials (TIM): Integration, Metrology and Reliability
TS
Tom Strothmann
TechSearch International
ConsultantPDC: Hybrid Bonding
KD
Karthik Dhandapani
General Chair, IMAPS Symposium 2026
Cerebras
VendorGeneral Chair
JM
Jaimal M. Williamson
General Chair-elect, IMAPS Symposium 2026
Texas Instruments
CustomerGeneral Chair-elect
BC
Benson Chan
Past General Chair, IMAPS Symposium 2026
Binghamton University
AcademiaPast General Chair